本书介绍了学习EDA所需的内容，从而揭开了这个高技术产业的神秘面纱。书中以友好、非正式的方式介绍EDA商业和技术，其内容对非专业读者足够清晰，对专业读者足够详细。本书面向EDA、半导体或相关产业中负责销售、市场、公关、法规、金融等的非技术人员，同时也可以作为VLSI设计中的交叉学科工程、商业和市场课程的优秀补充教材。
　　在本书中，经验丰富的产业领导者Mark Birnbaum简单而清晰地介绍了EDA要解决的设计问题、解决问题的工具、应用工具的设计者以及使得EDA成为电子产品和芯片设计关键的因素。另外，本书提供了供新入行者参考的丰富的附录，包括电子、半导体制造、计算和通用计量方面的入门资料、参考资源和完整的缩略语术语表。

本书的主要特点
●　解释EDA是如何适合电子产品和半导体产业的。
●　从工具使用者和EDA软件开发者的角度研究EDA产业，包括商业模型、投资回报和工具评价。
●　包括定义IC作用的电子系统级工具、设计IC行为的前端功能性芯片级工具、实现IC物理布局的后端设计工具。
●　讨论EDA产业的趋势和IC设计问题，包括深亚微米的挑战、知识产权和片上系统。
●　包括EDA标准组织和出版物。

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（美）Mark D.Birnbaum：（美）Mark D.Birnbaum:　　Mark D. Birnbaum 分别在普林斯顿大学和东北大学获得BSEE和MSEE学位。作为EDA的使用者、管理者、开发者和工具制造者，他对这个主题具有独特的权威性。Birnbaum在九大计算机、半导体、EDA和研究组织 (包括国家半导体级设计系统和富士通微电子公司) 的经验跨越了从系统产品到IC芯片的电子学设计领域。他在工程管理、咨询、R&D、产品开发、测试和市场方面担任高级职务，带领两个标准小组，并教授微电子学和EDA课程。

1. Introduction to EDA.
Introduction. Electronic Products. Printed Circuit (PC) Boards. Integrated Circuits. CAD, CAM, CAE, and EDA. Data, Signals, and Input/Output. Electronic Product Development. EDA Party—Users and Tools. System Design. Logic Design. ASIC Design. Physical Layout Design. EDA Benefits. Summary.



2. The Business of EDA.
Introduction. EDA User Return on Investment. EDA Vendor Return On Investment. EDA Tool Development Sources. In-house/Out-source EDA Tool Development. The Time-to-Market Competition. EDA Business Models. New EDA Tools. Licensing Models. Mergers and Acquisitions. Application Service Provider Model. Design Services Business. EDA Industry Growth. Relative Industry Sizes: EDA, IC, Electronics. Relative Risk Factor. EDA People and Conferences. People Opportunities. Key Conferences. Summary. Quick Quiz.



3. The User Perspective.
Introduction. Four Key EDA User Decisions. Organization. Computer Network. Security Requirements. Computer Systems. Engineering / Non-engineering Goals. How to Buy EDA Tools—Five Key Issues. Cost/Performance. Training and Support. Make or Buy. Compatibility. Transition. Standards Efforts—Who, What, and Why. Design Flow Integration. EDA Tool Interface Standards. Frameworks. Design Database Standards. Standards Groups. Personnel—The Key to EDA Support. University Connections. Summary. Quick Quiz.



4. Overview of EDA Tools and Design Concepts.
Introduction. Tool Improvements. Major Classes of EDA Tools. Electronic System-Level Design Tools. Front-end Design Tools. Back-end Design Tools. Essential EDA Concepts. Design Views. Design Data. Design Hierarchy. Design—The Art of Trial and Error. Design Styles. Design Partitioning. Architecture, Methodology, and Design Flow. IC Architectures. Design Methodology and Design Flow. Tool Suites. Summary. Quick Quiz.



5. Electronic System-Level Design Tools.
Introduction. Specification Guidelines. System-Level Design Tools. High-Level Modeling. System-Level Design Languages. Design Space Exploration and Trade-offs. Test Bench Creation. Other System-Level Tools. Hardware/Software Integration. Approaches to Co-Design. Hardware and Software Co-Design. Embedded Systems. Real Time. Reliability. Summary. Quick Quiz.



6. Front-end Design Tools.
Introduction. Design Capture Tools. Hardware Description Languages. Specialized Design Tools. Netlist Output. Design Capture Checking Tools. Verification Tools. Design Verification. Simulation. Simulation Speed. Formal Verification Tools. Device and Circuit Simulators. Timing Analysis Tools. Dynamic Timing Analysis. Static Timing Analysis. Clocks. Signal Timing. Design for Test Tools. Design for Test. Boundary Scan. Built-in Self Test. Power-Related Tools. Power Estimation Tools. Low-Power Design Tools. Synthesis Tools. Summary. Quick Quiz.



7. Back-end Design Tools (Physical Design).
Introduction. Physical Layout Tools. Floorplanning Tools. Placement and Routing Tools. Layout Styles. Power Routing Tools. Design Rule Check Tools. Extraction and Timing Analysis Tools. Signal Integrity Issues. Signal Integrity. Voltage Sensitivity. Noise Margin. Buffers. Switching Noise. Electromagnetic Interference. Metal Migration. Thermal Design Tools. Manufacturing Preparation Steps. Merging Operations. Electrostatic Discharge Protection. Mask-Making Preparations. Diagnostic and Manufacturing Tests. Automatic Test Pattern Generation. Product Engineering Tools. Porting Designs to New Processes. Summary. Quick Quiz.



8. Trends.
EDA Design Environment Trends. Integrated Design Suites. Run-Time Control Tools. Distributed Design. System Design Links to Chip Design. EDA Tool Trends. Design Closure. Formal Verification. Design Repair. Design for Test. Design for Manufacture (DFM) Trends. Design Redundancy. Chip-to-Chip Differences. Mask Enhancements. System-on-chip and IP Trends. Semiconductor Trends. Performance Design Issues. Power and Thermal Design Issues. Physical Design Issues. New Materials and Lithography150 Summary.



Appendix A: Elementary Electricity.
Introduction. Atoms and Electrons. Conductors, Insulators, and Semiconductors. Electrical Attributes. Electrical Current. Electrical Voltage. Resistance. Capacitance. Inductance. Direct and Alternating Current. Other Electrical Effects. Static Electricity. Coupling. Waves. Electrical Components. Semiconductor Devices.



Appendix B: Semiconductor Manufacturing.
Introduction. Manufacturing Process. Masks and Feature Size. Manufacturing Test. Packaging. IC Testing. Process Improvements.



Appendix C: Signals to Software.
Introduction. Transistor Circuits. Analog and Digital. Analog. Digital. Analog and Digital. Memory. Logic. Signal Delay. Computers. Software.



Appendix D: Metrics.
Introduction. Small Numbers. Large Numbers.



Appendix E: References.
Conferences. Organizations. Standards Groups. Publications. EDA Internet Sites. Universities.



Appendix F: ICs, IP, and SoC.
The IC Industry. Product Design. Integrated Circuit Design. Design Handoff. Design Re-use and Intellectual Property. Design Re-use. Intellectual Property. Types of IP Blocks. IP Vendor Business Models. IP Re-use Issues. System-on-Chip. SoC Issues. Platforms. Summary.



Appendix G: Glossary-Terms and Acronyms.


Index.